TSMC in "Due Diligence" on Possible Japan Fab
By Alan Patterson, EETimes (July 15, 2021)
Taiwan Semiconductor Manufacturing Co. (TSMC) is evaluating whether to build a chip facility in Japan as nations around the world are seeking the top foundry’s help to create secure electronics supply chains.
The company has established a 3D IC research center in Japan, where it has gathered more than 20 Japanese partners, TSMC said at its latest announcement of quarterly results. TSMC will be in charge of the center’s technology development for advanced packaging.
The company is also evaluating the possible start of a new chip fab in Japan, according to TSMC CEO C.C. Wei, speaking at the event.
“In Japan, we are in the due diligence process now to do that with a fab. Let me say that clearly.”
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
Related News
- After TSMC fab in Japan, advanced packaging facility is next
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- ESMC Breaks Ground on Dresden Fab
Latest News
- SEMIFIVE Files for Pre-IPO Review on KRX
- Innosilicon Scales LPDDR5X/5/4X/4 and DDR5/4 Combo IPs to 28nm and 22nm, Cementing Its Position as the ‘One Stop’ for Memory Interface Solutions
- Synopsys Completes Acquisition of Ansys
- Zephyr 4.0 Now Available for SCR RISC-V IP
- Lattice Semiconductor and Missing Link Electronics Become Partners to Accelerate FPGA Design Projects