TSMC in "Due Diligence" on Possible Japan Fab
By Alan Patterson, EETimes (July 15, 2021)
The company has established a 3D IC research center in Japan, where it has gathered more than 20 Japanese partners, TSMC said at its latest announcement of quarterly results. TSMC will be in charge of the center’s technology development for advanced packaging.
The company is also evaluating the possible start of a new chip fab in Japan, according to TSMC CEO C.C. Wei, speaking at the event.
“In Japan, we are in the due diligence process now to do that with a fab. Let me say that clearly.”
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