TSMC Goes Photon to Cloud
Rick Merritt, EETimes
October 4, 2018
The foundry’s update showed area and power gains continue in its leading-edge nodes, but chip speeds are no longer advancing at their historic rate. To compensate, TSMC gave an update on a half-dozen packaging techniques it is developing to speed connections between chips.
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- TSMC Will Struggle to Meet AI Demand for Years, Analysts Say
- TSMC 3-nm Upgrade in Japan to Catch up With Demand
- MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts
Latest News
- Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums
- TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology
- Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC’s 28nm SST eFlash
- AiM Future Partners with Metsakuur Company to Commercialize NPU-Integrated Hardware
- ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025