TSMC considers German fab
By David Manners, Electronics Weekly (July 26, 2021)
TSMC is looking at building a fab in Germany.
“We are currently doing reviews on Germany seriously, but it’s still in very early stages,” TSMC chairman Mark Liu told shareholders earlier today, “we continue to communicate with our major clients in Germany to see whether this is most important and effective for our clients.”
Liu added that “it’s too early to say” whether or not it will happen.
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
Related News
- Intel German fab in doubt
- After TSMC fab in Japan, advanced packaging facility is next
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- ESMC Breaks Ground on Dresden Fab
Latest News
- EnSilica cuts post-quantum cryptography (PQC) silicon area with three-in-one IP block
- Perceptia Devices Release pPLL08W, best-in-class RF PLL IP in GF22FDX
- Axiomise Partners With Bluespec to Verify Its RISC-V Cores
- Rapidus Achieves Significant Milestone at its State-of-the-Art Foundry with Prototyping of Leading-Edge 2nm GAA Transistors
- SEMIFIVE Files for Pre-IPO Review on KRX