TSMC Expected to Rebound in 2021 on AMD Gains
By Alan Patterson, EETimes (May 8, 2020)
TAIPEI — Taiwan Semiconductor Manufacturing Company (TSMC) is likely to see a strong rebound starting next year as fabless companies such as AMD grab market share from Intel, according to Wedbush Securities senior vice president Matt Bryson.
Fabless companies like AMD, Apple, HiSilicon, Nvidia and Qualcomm are the key TSMC customers that will increase orders on market share gains and high growth in end markets, Bryson said in an April 27 report provided to EE Times.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%, Says TrendForce
- TSMC to Open EU Design Center in Munich in Q3
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack