TSMC Likely to Lock up Apple A10, A11 Orders
Alan Patterson, EETimes
10/26/2016 00:00 AM EDT
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) will probably make nearly all of the A10 and A11 processors for Apple this year and next because of a competitive advantage the Taiwan foundry has gained in packaging technology, according to analysts.
TSMC has been ramping its InFO (Integrated Fan Out) packaging for Apple's A10 processor used in the new iPhone 7 smartphone. InFO uses fan out wafer level packaging rather than a flip-chip substrate to provide a 20% reduction in package thickness, a 20% speed gain and 10% better thermal performance.
The commercialization of this advanced packaging technology shifts semiconductor manufacturing into the “more than Moore” era as Moore’s Law is expected to reach its physical limits at 5nm design rules. TSMC has become the first with the new focus on packaging that increases chip I/O density beyond traditional ball-grid array technology by allowing multiple chips to be combined without an intervening substrate.
To read the full article, click here
Related Semiconductor IP
- Xtal Oscillator on TSMC CLN7FF
- Wide Range Programmable Integer PLL on TSMC CLN90G-GT-LP
- Wide Range Programmable Integer PLL on TSMC CLN80GC
- Wide Range Programmable Integer PLL on TSMC CLN7FF
- Wide Range Programmable Integer PLL on TSMC CLN6FF
Related News
- Apple A9 Orders Pivot to TSMC
- Apple Seen Splitting 14/16nm Orders Among Foundries into 2016
- Intel to place US$14 billion orders with TSMC, says report
- Altera says orders 'deteriorated' in February, predicts 24% drop in Q1 sales
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing