Plans start for TSMC 2nm fab
By Peter Clarke, eeNews Europe (July 01, 2021)
The details of the meeting held online were reported by Taiwan's Commercial Times.
The Hsinchu Science Park Baoshan Land Expansion Project Phase II is considering the environmental impact and mitigation activities for an expansion of Baoshon to provide for expansion of TSMC's 2nm manufacturing capacity.
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Rapidus Set to Open 2-nm Pilot Fab, CEO Says
- ESMC Breaks Ground on Dresden Fab
- Intel, TSMC to detail 2nm processes at IEDM
- TSMC 2nm to start production in Q4 2025
Latest News
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- Energy-efficient RF power modules developed using SOI technology