Thalia appoints Sou Bennani-McCord as Global VP of Sales
October 12, 2023 -- Thalia has appointed Sou Bennani-McCord as Global VP of Sales. An important addition to Thalia’s leadership team, Sou will play a key role in the company’s ongoing expansion plans and global growth.
Thalia’s Founder and CEO, Sowmyan Rajagopalan, says: “Sou brings over 25 years of experience in international sales and business development to Thalia having worked for both Intel and Mentor Graphics/Siemens. Her experience with sales in both mature and emerging markets, along with her diverse international business background, puts her in an excellent position to support Thalia’s ambitious growth plans and we’re thrilled that she is joining the management team.”
Sou brings a wealth of semiconductor market experience to her role, alongside a strong foundation of strategic business management expertise for technology companies. Sou also holds a Masters in economics and a Post Graduate degree in business management from the Université des Sciences et Technologies de Lille 1, France.
Commenting on her new role, Sou said: “I am excited to join the talented team at Thalia. Thalia’s unique offering and focus on analog and mixed-signal IP reuse offers unmatched value to the semiconductor industry. I look forward to taking an active role in Thalia’s growth and expansion plans.”
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Global Semiconductor Sales Increase 0.3% Month-to-Month in April
- Single Carrier Modem Available For Immediate Licensing From Global IP Core
- Global Semiconductor Sales Increase 1.7% Month-to-Month in May
- Global Semiconductor Equipment Sales Forecast: $87 Billion in 2023 With 2024 Rebound, SEMI Reports
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack