Thalia appoints Sou Bennani-McCord as Global VP of Sales
October 12, 2023 -- Thalia has appointed Sou Bennani-McCord as Global VP of Sales. An important addition to Thalia’s leadership team, Sou will play a key role in the company’s ongoing expansion plans and global growth.
Thalia’s Founder and CEO, Sowmyan Rajagopalan, says: “Sou brings over 25 years of experience in international sales and business development to Thalia having worked for both Intel and Mentor Graphics/Siemens. Her experience with sales in both mature and emerging markets, along with her diverse international business background, puts her in an excellent position to support Thalia’s ambitious growth plans and we’re thrilled that she is joining the management team.”
Sou brings a wealth of semiconductor market experience to her role, alongside a strong foundation of strategic business management expertise for technology companies. Sou also holds a Masters in economics and a Post Graduate degree in business management from the Université des Sciences et Technologies de Lille 1, France.
Commenting on her new role, Sou said: “I am excited to join the talented team at Thalia. Thalia’s unique offering and focus on analog and mixed-signal IP reuse offers unmatched value to the semiconductor industry. I look forward to taking an active role in Thalia’s growth and expansion plans.”
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Global Semiconductor Sales Increase 2.3% Month-to-Month in July
- NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core
- Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence
- Global Semiconductor Sales Increase 1.9% Month-to-Month in August
Latest News
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
- EnSilica and Codasip announce strategic partnership
- Empower Semiconductor Secures Over $140M in Series D Financing
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI