TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs
TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs
Freiburg, Germany - Grenoble, France – February 7, 2019 -- TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products.
TDK-Micronas is a renowned company on the automotive market, especially for its world´s largest Hall sensor portfolio covering all automotive applications in Powertrain, Chassis & Safety, and Body & Comfort.
Automotive market requirements are currently driven by three new major trends: electrification, increasing connectivity and autonomous driving. These are directly impacting the design as well as the usage of car sensors, and their number. The number of sensors that require a smaller surface area, as well as reduced power consumption, in order to achieve the energy efficiency imposed by a constrained energy source should increase by a factor of seven by 2025.
“TDK-Micronas decided to use Dolphin Integration’s RAM and ROM silicon IPs for its new generation of 3D Hall magnetic sensor products, thanks to the best fit of small footprint, low power and high electrical performance, as well as for the strong support received during the design phase” says Mario Anton, Vice President R&D at TDK-Micronas.
“The RAM PLUTON and the ROM CASSIOPEIA architectures are part of an energy efficient silicon IP large offering that have been manufactured on numerous ICs, with a cumulative volume of up to 800 000 wafers” says Frédéric Renoux, Executive Vice President at Dolphin Integration.
About TDK-Micronas
TDK-Micronas is the most preferred partner for sensing and control. TDK-Micronas serves all major automotive electronics customers worldwide, many of them in long-term partnerships for lasting success. Operational headquarters are based in Freiburg in Breisgau (Germany). Currently, TDK-Micronas employs around 1000 people.
For more information about TDK-Micronas and its products, please visit www.micronas.com.
About Dolphin Integration
Founded in 1985, Dolphin Integration currently employs 160 employees in their head office located in Meylan, France and operates subsidiaries in Canada and Israel. Dolphin Integration develops semiconductor IPs serving high volume fabless IC companies worldwide and offers integrated circuit design services to the European Defense and Aeronautic industry.
Conscious of AI, IoT, mobile and automotive products’ explosive growth and potential environmental impact, Dolphin Integration is committed to accelerating the development of energy-efficient System-on-Chip (SoC) for its customers.
For more information, contact Aurélie Descombes, PR Manager at Aurelie.descombes@dolphin.fr or visit our website www.dolphin-integration.com
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process
- Dolphin Integration offers a live webinar on the proven recipe for uLP SoC
- Dolphin Integration Receives Open-Silicon's Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem
- Extending 2 to 5 times the operation time of your battery-powered SoC
Latest News
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations