SoC collaboration network signs agreement with CSIP
(08/26/2005 1:34 PM EDT)
SAN FRANCISCO — Design and Reuse (D&R), a global collaboration network for sharing system-on-chip (SoC) design resources, said Friday that it has formed a partnership with China Software and Integrated Circuit Platform (CSIP).
The agreement includes a secure entry portal from CSIP to D&R. The agreement also includes a cooperation plan for completing a database, enhancing provider visibility, organizing common events and training.
"I am delighted to see that intellectual property in electronic design contributes to create a connected world," said Gabriele Saucier chair of D&R, in a statement. "We hope to open more market opportunities to D&R partner companies and enlarge the community of 37,000 registered users of our portal."
Yanhui Wang, general manager of CSIP's IC business division, said the agreement with D&R would contribute to establishing appropriate links between CSIP and mature SoC players.
CSIP is an institution through which the Chinese government guides the development of the software and IC industries and provides resources and technical services for innovation.
D&R is partly owned by CMP Media LLC, which also owns EE Times.
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved.
| Your California Privacy Rights | Terms of Service
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 10-bit Pipeline ADC - Tower 180 nm
- Simulation VIP for Ethernet UEC
- Automotive Grade PLLs, Oscillators, SerDes PMAs, LVDS/CML IP
- CAN-FD Controller
Related News
- Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
- Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
Latest News
- Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms
- M31 Debuts at ICCAD 2025, Empowering the Next Generation of AI Chips with High-Performance, Low-Power IP