Samsung Describes 10nm SRAM
Area-optimized design shows 38% shrink
Rick Merritt, EETimes
2/4/2016 08:00 AM EST
SAN FRANCISCO – Samsung gave a peek at its 10nm finFET technology and an advanced 128 Mbit SRAM made in the process in a paper at the International Solid-State Circuits Conference (ISSCC) here.
A version of the new 6T SRAM bitcell optimized for size is 38% smaller than a similar part in Samsung’s 14nm process. It measures 0.040mm2 compared to 0.049mm2 for a version optimized for high current.
SRAMs take up as much as 30% of mobile applications processors and smaller size is generally a welcome indication of lower cost per transistor, Samsung noted. However in the case of the 10nm SRAM, small size created a problem.
To read the full article, click here
Related Semiconductor IP
- 1.8V Capable GPIO on Samsung Foundry 4nm FinFET
- High Bandwidth Memory 3 (HBM3/3E) IP optimized for Samsung SF4X
- LPDDR5X/5/4X/4 combo PHY at Samsung SF5A
- MIPI D-PHY Transmitter/Receiver for DSI/CSI-2 on Samsung 28nm FD-SOI
- Samsung 5LPE 1.8V/3.3V SD/eMMC PHY AP2
Related News
- MoSys adds soft-error protection, correction to 1-transistor SRAM for 'free'
- MoSys SRAM sports symmetric pipeline
- UMC to port MoSys' one-transistor SRAM cell to advanced logic processes
- Embedded SRAM test and repair moves on-chip
Latest News
- Fabless Startup Aheesa Tapes Out First Indian RISC-V Network SoC
- SmartDV and Mirabilis Design Announce Strategic Collaboration for System-Level Modeling of SmartDV IP
- GUC Monthly Sales Report – January 2026
- IBM, Synopsys Move Toward 1.4-nm Node with Heat-Modeling Tech
- UMC Reports Sales for January 2026