Rambus Names Eric Ries Vice President and Managing Director of Japan Office
LOS ALTOS, Calif.--(BUSINESS WIRE)--July 14, 2005--Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced that Eric Ries has been named Vice President and Managing Director of its Japan office. In this position, Mr. Ries will report to Sharon Holt, Rambus's Senior Vice President of Worldwide Sales and Marketing. Mr. Ries is responsible for the overall management and direction of Rambus's strategic customer and partnership relationships in Japan.
Mr. Ries comes to Rambus from Cypress Semiconductor, where he has spent the past four years, most recently as the Japan Distribution Sales Manager. Prior to Cypress, Eric was Regional Sales Manager for In-System Design, an ASIC design company that was acquired by Cypress in 2001. At In-System Design, Mr. Ries was responsible for sales and business development in Japan, the U.S. and Europe.
"Eric brings a wealth of experience in the Japanese market as well as the semiconductor industry that will prove valuable for us to maintain our solid position in the region," said Sharon Holt, senior vice president of worldwide sales and marketing at Rambus. "There continues to be good prospects for our technology solutions in Japan and we look forward to Eric's help and experience to expand our customer base and look for additional opportunities for revenue growth in the region."
Mr. Ries holds a BA from Brigham Young University and currently lives in Tokyo with his family.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus's interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.
Mr. Ries comes to Rambus from Cypress Semiconductor, where he has spent the past four years, most recently as the Japan Distribution Sales Manager. Prior to Cypress, Eric was Regional Sales Manager for In-System Design, an ASIC design company that was acquired by Cypress in 2001. At In-System Design, Mr. Ries was responsible for sales and business development in Japan, the U.S. and Europe.
"Eric brings a wealth of experience in the Japanese market as well as the semiconductor industry that will prove valuable for us to maintain our solid position in the region," said Sharon Holt, senior vice president of worldwide sales and marketing at Rambus. "There continues to be good prospects for our technology solutions in Japan and we look forward to Eric's help and experience to expand our customer base and look for additional opportunities for revenue growth in the region."
Mr. Ries holds a BA from Brigham Young University and currently lives in Tokyo with his family.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus's interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Tensilica Promotes Hiroyuki Uchimura to Managing Director of Japan Office
- Siemens Digital Industries Software appoints new Senior Vice President and Managing Director for Asia Pacific region
- Tensilica Hires Myeong-heum Yeon as Managing Director, Korea Office
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract