Q&A: Denali's Srivastava bridges EDA, IP domains
Richard Goering, EE Times
(12/15/2006 12:43 PM EST)
(12/15/2006 12:43 PM EST)
Sanjay Srivastava, president and CEO of Denali Software Inc., has led the company since its inception over 10 years ago. Denali today provides verification intellectual property (IP) for memories and standard interfaces, design IP for memories, a flash file development system, and the Blueprint electronic system level (ESL) tool for embedded register design. Srivastava answered some questions about Denali, IP, and EDA in the following interview.
- Is Denali an EDA company, and IP company, or some combination of both?
- What embedded software product are you offering?
- You're putting a big push on NAND flash right now. Why is that?
- Third party IP is a challenging business, with lots of problems around integration and verification. How do you approach those issues?
- You're on the board of the EDA Consortium, and there's been a question about whether EDAC should include IP revenues in its EDA market statistics. What do you think?
- Denali is best known for its memory and IP expertise. So how does your Blueprint product, and its System Register Description Language (System RDL), fit into your strategy?
- How large is Denali now?
- Any thoughts about an IPO?
- Denali is well known for having the best party at the Design Automation Conference every year. What are your plans for 2007?
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Sanjay Srivastava, Former Denali CEO, Joins Proton Digital Systems as Executive Chairman
- Arteris Bridges Hardware-Software Gap with New EDA Tool
- QuickLogic Announces Appointment of Andy Jaros as Vice President of IP Sales
- Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack