ComLSI awarded second US Patent in Active VLSI Packaging (AVP) technology
Mesa, AZ -- June 30, 2008 -- ComLSI announces issuance of its second patent on Active VLSI Packaging and Active Noise Regulation entitled "VOLTAGE DROOP SUPPRESSING CIRCUIT" as US Patent 7378898.
This patent protects circuit technology relating to High-Bandwidth Voltage Regulation that is a key component of active VLSI packaging (AVP) and active noise regulation. Employing a controlled transistor switch between a package capacitor and the chip power grid, the patented invention enables rapid charge transfers and high-bandwidth, low-cost on-package voltage regulation. It is particularly suitable for voltage domains in multi-core nanoprocessors.
When issued, the patent text can be accessed at US Patent #7378898. Further technology information can be provided under a mutual Corporate NDA.
Related Semiconductor IP
- 5G-NTN Modem IP for Satellite User Terminals
- 5G-Advanced Modem IP for Edge and IoT Applications
- TSN Ethernet Endpoint Controller 10Gbps
- 13ns High-Speed Comparator with no Hysteresis
- Frequency Divider
Related News
- LSI Logic licenses packaging technology to Taiwan firm
- Nordic VLSI Selects Mentor Graphics FormalPro Equivalence Checker for Formal Verification Solution
- Dense-Pac applies chip-stacking packaging to DSPs
- TriMedia Technologies, Inc. Announces Appointment of Jim Thomas To Vice President, VLSI Design
Latest News
- IPrium releases LunaNet AFS LDPC Encoder and Decoder for Lunar Navigation Satellite Systems
- Quintauris Introduces Altair: The Unified RISC-V Profile for Embedded Systems
- IAR accelerates SDV development with Infineon DRIVECORE bundles and AURIX™ RISC-V Debug capabilities
- Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals
- Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets