Moortec to exhibit at DAC 2017 in Austin
Plymouth, UK -- May 19, 2017 -- Moortec Semiconductor will be exhibiting at DAC 2017 from the 19th - 22nd June in Austin, Texas. DAC (Design Automation Conference) is taking place at the at the Austin Convention Center so why not come and meet us at booth #2014 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec's high performance In-Chip Sensors.
The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors.
Moortec provide market-leading embedded monitoring IP subsystems for today’s technologies and specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors. Moortec's IP enables SoC designs to be performance optimised and monitored on a per die basis and offers support for AVS/DVFS.
If you are working on advanced node technologies it is highly likely that your SoC will require monitoring to enhance real-time performance optimisation and lifetime reliability. Understanding how the chip has been made (process) as well as understanding its dynamic conditions (voltage supply and junction temperature) has become a critical requirement for advanced node semiconductor design.
Moortec offers a range of 'off the shelf' monitoring IP on TSMC 40nm, 28nm, 16nm and have recently announced the availability of their design kit on TSMC’s 7nm process.
About Moortec
Established in 2005 Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies from 40nm down to 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimization, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production.
If you would like to arrange a meeting at the event please contact Ramsay Allen on +44 1752 875133 or email: ramsay.allen@moortec.com
For more information please visit www.moortec.com
Related Semiconductor IP
- Flash Memory LDPC Decoder IP Core
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- FH-OFDM Modem
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- PQC CRYSTALS core for accelerating NIST FIPS 202 FIPS 203 and FIPS 204
Related News
- Moortec to exhibit at the 2017 TSMC Technology Workshop in Austin
- Vidatronic to Exhibit at 54th Design Automation Conference (DAC) in Austin, TX
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 Design & Reuse IP SoC Event in Shanghai