Kandou AI Appoints Taher Madraswala as Chief Operating Officer

SAINT-SULPICE, SWITZERLAND – December 15th, 2025 – Kandou AI is pleased to announce the appointment of Taher Madraswala as Chief Operating Officer (COO) for the company’s next stage of growth.

Building on Kandou AI’s strong heritage of building market-leading silicon, our new vision is centred on using our groundbreaking interconnect technology to democratize Artificial Intelligence. By partnering with our customers, we aim to enable build out of low-cost, scalable AI systems – helping make AI ubiquitous and accessible to all.

Leveraging its proven, innovative Copper MIMO Link technology which has been shipping in large volumes since 2018, Kandou AI is developing revolutionary AI fabric solutions that will enable our customers spanning four markets – AI Inference, AI Training, CXL based memory platforms and Rack connectivity – build cost effective, scalable AI systems. Its low power, low latency, high bandwidth interconnect technologies significantly extend the reach of chip-to-chip communication links across the PCB facilitating new system architectures which (i) reduce the cost of AI inference systems by upto 12x, (ii) provide highest capacity tier-2 memory in AI training clusters, (iii) enable usage of low-cost servers for large in-memory databases reducing capex by upto 2.5x and (iv) increase reliability and reduce mean repair time of co-packaged optics solutions by over 10x.

Taher Madraswala – Chief Operating Officer

Taher brings more than three decades of deep silicon and operational leadership experience across engineering, operations, and the scaling of complex global organizations. In his role, he will oversee Kandou AI’s engineering and operations functions, guiding end-to-end execution of Kandou AI’s product roadmap—from silicon development and supply chain through customer delivery and long-term support.

Taher joins Kandou AI following senior leadership roles at Quest Global, Intel, Open-Silicon, and HAL Computer Systems. Most recently, as Vice President at Quest Global, he served as Strategic Client Partner for a leading Japanese semiconductor company, delivering long-term engineering agreements exceeding $200 million and supporting the build-out of a new semiconductor division. At Intel, he held the role of Vice President and General Manager, managing Custom Silicon business across automotive, graphics, and specialized silicon programs.

Earlier in his career, Taher served as President and CEO of Open-Silicon, where he led the company’s turnaround to a successful acquisition. Under his leadership, Open-Silicon grew to over $120 million in annual revenue, executed 300+ tapeouts, and shipped 350 million silicon devices. He also co-authored a scalable design methodology enabling parallel execution across large engineering teams and introduced the operational metrics—predictability, reliability, and affordability—that defined the company’s execution culture.

Taher’s background combines hands-on silicon expertise with disciplined P&L management and operational execution, including building high-performing global teams and driving programs into volume production.

His appointment further strengthens Kandou AI’s ability to deliver cutting edge AI products, redefine the connectivity architecture and economics of AI systems as the company scales its next generation of high-performance interconnect solutions.

About Kandou AI

Kandou AI is on a mission to democratize artificial intelligence by enabling the development of low-cost, scalable, and energy-efficient AI systems. Kandou AI is pioneering breakthrough solutions that will help our customers lower the barriers to AI adoption by lowering costs —empowering businesses, developers, and researchers with the tools they need to unlock AI’s full potential.

Kandou AI’s cutting-edge technology has been integrated into more than 28 million chips worldwide, showcasing its industry-leading expertise in high-speed, energy-efficient connectivity solutions. With a strong track record of innovation, Kandou has successfully delivered over 13 million custom silicon chiplets, serving the unique needs of more than 16 customers across various industries. This achievement underscores Kandou AI’s commitment to advancing semiconductor technology and enabling next-generation computing.