Huawei to end production of leading edge mobile chipsets
By David Manners, Electronics Weekly (August 10, 2020)
Huawei is to end production of its top-of-the- range Kirin mobile processors in September, according to Caixin Global, the Chinese state news site.
“From Sept. 15 onward, our flagship Kirin processors cannot be produced,” Richard Yu (pictured) CEO of Huawei’s consumer unit said at the recent Mate 40 launch, “our AI-powered chips also cannot be processed. This is a huge loss for us.”
The US has barred any fab which uses US manufacturing equipment from making chips for Huawei’s chip subsidiary HiSilicon.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- Parameterizable compact BCH codec
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
Related News
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications
- NXP Completes Acquisitions of Aviva Links and Kinara to Advance Automotive Connectivity and AI at the Intelligent Edge
- BrainChip Announces $25 Million (USD) Funding Ahead of CES to Power Next-Gen Edge AI
Latest News
- ISOLDE Project Demonstrates Advancements in European Open-Source RISC-V for Automotive, Space, and IoT
- ACL Digital and AIM FUTURE Partner to Drive Innovation in Edge AI
- Tenstorrent and PwC Partner to Advance AI Ecosystem Development in Cyprus
- Republic of Cyprus Selects Tenstorrent for AI Innovation
- SiFive and IAR Collaborate to Advance the Automotive Ecosystem and Drive RISC-V Innovation in Automotive Electronics