Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
By Nitin Dahad, EETimes
September 6, 2019
Berlin, Germany — Mobile processors with integrated 5G modems are the flavor of the week, as Europe’s equivalent of CES kicked off in Berlin with launches from Huawei, Samsung and Qualcomm.
With big fanfare, Huawei launched what it claims is the world’s first flagship 5G system on chip (SoC), the Kirin 990 5G, a 10.3 billion transistor chip manufactured in a TSMC 7nm+ EUV process and supporting both non-standalone (NSA) and standalone (SA) radio architectures simultaneously. The chip will be a key feature of the Huawei Mate 30 phone launching in a couple of weeks.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- SK hynix's memory chips next in Huawei's 5G phone saga
- SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company
- Soitec announces POI substrates business agreement with Qualcomm Technologies for 5G RF filters
- EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
Latest News
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
- EnSilica and Codasip announce strategic partnership
- Empower Semiconductor Secures Over $140M in Series D Financing
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI