How the Worlds of Chiplets and Packaging Intertwine
By Majeed Ahmad, EETimes (September 26, 2023)
In chip packaging, the bare chip die is encapsulated in a supporting case with electrical contacts. The case protects the bare die from physical harm and corrosion and connects the chip to a PCB. This form of chip packaging has existed for decades.
To read the full article, click here
Related Semiconductor IP
- UCIe PHY (Die-to-Die) IP
- UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
- UCIe D2D Adapter
- UCIe Die-to-Die Chiplet Controller
- UCIe IP
Related News
- Chips&Media and Visionary.ai Unveil the World’s First AI-Based Full Image Signal Processor, Redefining the Future of Image Quality
- Innatera and 42T join forces to power the next wave of intelligent product innovation
- Skymizerʼs HyperThought™ Wins “Best IP/Processor of the Yearˮ and “Most Promising Productˮ at EE Awards Asia 2025
- Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing
Latest News
- 10xEngineers and Andes Enable High-Performance AI Compilation for RISC-V AX46MPV Cores
- GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification
- Europe’s stealth leading-edge process technology
- Combined CapEx of Top Eight CSPs to Exceed $710 Billion in 2026; Google Leads ASIC Deployment with TPUs