How the Worlds of Chiplets and Packaging Intertwine
By Majeed Ahmad, EETimes (September 26, 2023)
Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. However, while chiplet and packaging technologies work hand in hand to redefine the possibilities of chip integration, this technological tie-up isn’t that simple and straightforward.
In chip packaging, the bare chip die is encapsulated in a supporting case with electrical contacts. The case protects the bare die from physical harm and corrosion and connects the chip to a PCB. This form of chip packaging has existed for decades.
To read the full article, click here
Related Semiconductor IP
- UCIe Chiplet PHY & Controller
- The UCIe CONTROLLER IP
- UCIe D2D Adapter
- Simulation VIP for UCIE
- UCIe Verification IP
Related News
- eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
- 30 minutes with Altera CEO Sandra Rivera discussing the Past, Present, and Future of a major FPGA vendor
- Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P