How the Worlds of Chiplets and Packaging Intertwine
By Majeed Ahmad, EETimes (September 26, 2023)
Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. However, while chiplet and packaging technologies work hand in hand to redefine the possibilities of chip integration, this technological tie-up isn’t that simple and straightforward.
In chip packaging, the bare chip die is encapsulated in a supporting case with electrical contacts. The case protects the bare die from physical harm and corrosion and connects the chip to a PCB. This form of chip packaging has existed for decades.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter
- UCIe Die-to-Die Chiplet Controller
- Verification IP for UCIe
- UCIe Die-to-Die Controller IP
- UCIe Die-to-Die PHY
Related News
- eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
- Neumonda and Ferroelectric Memory Company Collaborate in the Commercialization of Non-Volatile DRAM
- Enabled on makeChip and powered by Racyics, the SpiNNaker2 chip forms the core of the newly launched SpiNNcould supercomputer!
Latest News
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April
- Speedata Raises $44M to Launch First-Ever Chip Designed Specifically for Accelerating Big Data Analytics - Compute's Second Largest Workload