How the Worlds of Chiplets and Packaging Intertwine
By Majeed Ahmad, EETimes (September 26, 2023)
Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. However, while chiplet and packaging technologies work hand in hand to redefine the possibilities of chip integration, this technological tie-up isn’t that simple and straightforward.
In chip packaging, the bare chip die is encapsulated in a supporting case with electrical contacts. The case protects the bare die from physical harm and corrosion and connects the chip to a PCB. This form of chip packaging has existed for decades.
To read the full article, click here
Related Semiconductor IP
- UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
- UCIe D2D Adapter
- UCIe Die-to-Die Chiplet Controller
- Simulation VIP for UCIE
- UCIe Controller add-on CXL3 Protocol Layer
Related News
- RISC-V: Shaping the Future of Mobility with Open Standards and Strong Partnership
- Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation
- NXP Completes Acquisitions of Aviva Links and Kinara to Advance Automotive Connectivity and AI at the Intelligent Edge
- ARM pushes chiplets and 3D packaging for Neoverse chips
Latest News
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms
- M31 Debuts at ICCAD 2025, Empowering the Next Generation of AI Chips with High-Performance, Low-Power IP
- Perceptia Begins Port of pPLL03 to Samsung 14nm Process Technology
- Spectral Design and Test Inc. and BAE Systems Announce Collaboration in RHBD Memory IP Development