The #ARM Diaries, Part 1: How ARM's Business Model Works
Anand Lal Shimpi
It must frustrate ARM just how much attention is given to Intel in the ultra mobile space, especially considering the chip giant’s effectively non-existent market share. Since 2008 Intel has tried, year after year, to break into smartphones and tablets with very limited success. Despite having the IP and technical know-how to do so, it wasn’t until 2012 that we saw Intel act like a company with even a sliver of a chance. Today, things are finally starting to change. Intel’s 22nm SoC process and updated Atom microarchitecture look very competitive, and we’ll see the first tablet products based on them later this year - with phones following sometime in early 2014. As Intel is about to start acting like a competitor, ARM is starting to talk a lot more about its magic.
We’ve had well over a decade of Intel sharing its beliefs with us, but this is ARM’s first attempt at doing the same. What will follow over the next few posts are a bunch of disclosures, some related some not, attempting to bring everyone up to speed on where ARM is today and where ARM will be in the near future. The best place to start is with ARM’s business model.
In the PC industry, the concept of a fabless semiconductor manufacturer isn’t unusual. NVIDIA has always been one, and now AMD is one as well. Fabless semiconductors create all of the designs for their chips, but they’re physically manufactured at a foundry partner (e.g. TSMC, Global Foundries, Samsung). The fabless semi approach greatly helps reduce costs, but your designs are ultimately at the mercy of your foundry partner. Capacity, quality of process and timeline for process are more or less out of your control. Sometimes this is a non-issue, but other times it dramatically impacts your ability to bring products to market (e.g. quality control for early TSMC 40nm, timeline for GF 28nm or early capacity for TSMC 28nm).
To read the full article, click here
Related Semiconductor IP
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
Related News
- How ARM's Cortex-A7 Beats the A15
- Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development
- Control of Arm's China business transferred to Chinese investors
- Former Intel exec to lead Arm's automotive and embedded business
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost