HDL Design House to Exhibit at DAC as ARM Approved Design Partner
Belgrade, Serbia – June 13th, 2017 - Meet us at the ARM booth, number 729, at DAC on June 19th from 2-6 pm, as one of the ARM Approved Design Partners.
Our Managing Director, Bogdan Bizic, will participate in the panel discussion entitled “Identifying the major challenges facing SoC designs before 2020”
Come and listen to ARM Approved design partners debate what they consider will be their major challenges in SoC design over the next three years. The design partners will draw upon their own experiences of dealing with increasingly complex technology, customer’s growing expectations and the challenges of new sectors such as IOT to identify the main issues. The partners will also be asked to share what steps they think should be taken to address the problems they have highlighted.
The panel discussion will take place at the ChipEstimate booth at DAC on Monday, June 19th at 3 pm, and will be chaired by Chris Shore, ARM Technical Director.
HDL Design House joined the ARM Approved Design Partner program in December, 2016, and is recognized by ARM as accredited partner in specific technologies and activities.
Please contact Milena Jovanovic, HDL DH Marketing Manager, m-jovanovic@hdl-dh.com to get more information or to schedule a meeting with us at DAC.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- HDL Design House Selected as ARM Approved Design Partner
- SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment
- Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
- ASIC supplier ICsense selected for GlobalFoundries’ official design partner network
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack