Gowin Semiconductor Unveils the Latest Embedded Memory Products for their Families of Programmable Logic Devices
Guangzhou, China -- September 17, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces 2 new additions to the current families of embedded memory FPGA devices, the GW1NR-LV4MG81 and GW1NSR-LX2CQN48. As computing functions are being distributed to edge locations, the need for silicon to adapt to these new uses is becoming prevalent. The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind.
Adopting an edge to cloud infrastructure is challenging. Each portion of the chain has its own unique characteristics in design. For the edge, size of sensor or data gatherer affects product real estate; power consumption affects the power source, especially battery life. The new embedded memory FPGA devices solve these issues by enhancing the integration of multiple devices into a nice, single package device.
“GOWIN’s vision has always been one of developing new products for customer’s needs,” said Jason Zhu, CEO of GOWIN Semiconductor. “We saw a lack of product integration at the edge and aimed to fix this with easy to use solutions at cost-effective price points.”
The GW1NR-LV4MG81 is a 4K LUT FPGA fabric with 64Mb internal high-speed memory. The package size is ultra-small, 4.5mm x 4.5 mm PBGA and .83mm thick. A great logic device for applications where the thickness is an issue. Power consumption has been optimized to the lowest possible using TSMC’s 55nm LP process. And up to 69 user IO’s are available supporting GOWIN’s flexible IO structures.
In a 5mm x 5mm QFN package, the GW1NSR-LX2CQN48 is GOWIN’s first device that combines a 2K LUT FPGA fabric with 32Mb internal high-speed memory and an Arm Cortex M3 microprocessor. With additional user programmable flash, internal SRAM, ADC, and both USB2.0 and MIPI D-PHY interfaces, this makes the GW1NSR-LX2CQN48 a true SoC to solve low power requirements at the edge and elsewhere.
GOWIN offers a complete all-in-one toolchain for both FPGA fabric programming and Cortex M3 programming. In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions. All of these resources are available for download on GOWIN’s website, www.gowinsemi.com.
About GOWIN Semiconductor Corp.
Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
For more information about GOWIN, please visit www.gowinsemi.com
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
- GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
- GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack