Globalfoundries, TSMC square off in litho
Mark LaPedus, EETimes
3/1/2011 6:37 PM EST
SAN JOSE, Calif. – It’s a clash of the titans in the foundry industry between Globalfoundries Inc. and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
The silicon foundry rivals are separately expanding their process offerings and services for customers, but they have different strategies to knock each other off from their respective perches.
For example, Globalfoundries has a high-k/metal-gate only offering for the gate stack at 28-nm. In contrast, TSMC is offering both a high-k/metal-gate and polysilicon gate-stack options at the node. TSMC is pushing hard for 450-mm fabs. Globalfoundries and other members of IBM Corp.’s ''fab club’’ have been less vocal about 450-mm.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- Neuromorphic Processor IP
- Lossless & Lossy Frame Compression IP
Related News
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- TSMC shuns high-NA EUV lithography
- Cadence Extends DFM Solution with Acquisition of Design-side Litho and Variability Leader Clear Shape Technologies
- TSMC's R&D boss addresses 40-nm yields, high-k, litho
Latest News
- SignatureIP Achieves PCI-SIG® PCIe® 5.0 Certification, Joining Elite Group on Official Integrators List
- GUC Monthly Sales Report – August 2025
- eSOL and Infineon Enter Strategic Partnership for Next-generation Automotive Platforms Based on RISC-V/TriCore/Arm Microcontrollers
- Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
- Cadence to Acquire Hexagon’s Design & Engineering Business, Accelerating Expansion in Physical AI and System Design and Analysis