Globalfoundries, TSMC square off in litho
Mark LaPedus, EETimes
3/1/2011 6:37 PM EST
SAN JOSE, Calif. – It’s a clash of the titans in the foundry industry between Globalfoundries Inc. and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
The silicon foundry rivals are separately expanding their process offerings and services for customers, but they have different strategies to knock each other off from their respective perches.
For example, Globalfoundries has a high-k/metal-gate only offering for the gate stack at 28-nm. In contrast, TSMC is offering both a high-k/metal-gate and polysilicon gate-stack options at the node. TSMC is pushing hard for 450-mm fabs. Globalfoundries and other members of IBM Corp.’s ''fab club’’ have been less vocal about 450-mm.
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related News
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- TSMC shuns high-NA EUV lithography
- Cadence Extends DFM Solution with Acquisition of Design-side Litho and Variability Leader Clear Shape Technologies
- TSMC's R&D boss addresses 40-nm yields, high-k, litho
Latest News
- Intel facing another crossroads: 18A or 14A process node
- Creonic Successfully Renewed its ISO 9001:2015 Certification
- Silvaco Strengthens Leadership Team with Three Industry Veterans to Drive Innovation and Growth
- JFE Shoji Electronics Signs Sales Agent Agreement with Andes Technology
- Mixel Supports Automotive SerDes Alliance (ASA) Motion Link SerDes IP