Globalfoundries, TSMC square off in litho
Mark LaPedus, EETimes
3/1/2011 6:37 PM EST
SAN JOSE, Calif. – It’s a clash of the titans in the foundry industry between Globalfoundries Inc. and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
The silicon foundry rivals are separately expanding their process offerings and services for customers, but they have different strategies to knock each other off from their respective perches.
For example, Globalfoundries has a high-k/metal-gate only offering for the gate stack at 28-nm. In contrast, TSMC is offering both a high-k/metal-gate and polysilicon gate-stack options at the node. TSMC is pushing hard for 450-mm fabs. Globalfoundries and other members of IBM Corp.’s ''fab club’’ have been less vocal about 450-mm.
To read the full article, click here
Related Semiconductor IP
- 50G PON LDPC Encoder/Decoder
- UALink Controller
- RISC-V Debug & Trace IP
- UALinkSec Security Module
- PUF-based Post-Quantum Cryptography (PQC) Solution
Related News
- GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers
- TSMC shuns high-NA EUV lithography
- Cadence Extends DFM Solution with Acquisition of Design-side Litho and Variability Leader Clear Shape Technologies
- TSMC's R&D boss addresses 40-nm yields, high-k, litho
Latest News
- OpenTitan Introduces New Membership Tiers and Deliverables to Accelerate Deployment
- ZeroPoint Technologies Appoints Brett Cline as Chief Executive Officer
- Neurophos Secures $110 Million Series A to Launch Exaflop-Scale Photonic AI Chips
- Akeana tapes out highest performance RVA23 Alpine test chip
- Access Advance Closes 2025 with Record Quarter: Eight Major Licensees, 100% Renewal Rate, Litigations Resolved