Global Unichip Completes First Successful 65nm Tape-Out in Taiwan

Design with major global digital camera vendor marks first of four planned 65 nm tape-outs in first half of 2007

Hsin-Chu, Taiwan -- April 20, 2007 -- Global Unichip Corp. (GUC) (TAIEX: 3443), a leading SoC design service and total solution provider, today announced that it has accomplished the first successful 65nm tape-out in Taiwan. The project is for a digital camera from a major global brand.

@@This successful tape-out marks the first of four 65 nm tape-outs planned by GUC in the first half of 2007. The company is also planningtwo testchip tape-outs in 45nm before the end of 2007. Additionally, projects using GUCfs 90nm process will begin mass production later this year.

@@gWe are very proud to be the first company in Taiwan to successfully complete a 65nm tape-out,h stated K.C. Shih, founder and CEO of Global Unichip. gGUCfsproven achievements in advanced technology demonstrateour capability to handle complicated SoC design projects and also to provide the best turn-key services for our customers.h

@@gAs consumer electronics become smaller and lighter, designing a multi-function, low-power system in a small form factor is a major challenge for todayfs IC designers,h said Jim Lai, president and COO of Global Unichip. gGUCfs expertise in managing necessary logistic flows, coupled with its position in the integrated IC supply chain, will help customers meet these increasing demands with a short time-to-market and first run silicon success.h

@@GUCfs designs target applications in consumer electronics, communications and computing, including:networking, GPS, mobile phones, TV, DV camcorder, surveillance systems, WiMax and more.

About Global Unichip

Global Unichip Corp. (GUC), a dedicated full service SoC (System-On-Chip) Design Foundry based in Taiwan, was founded in 1998. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC turnkey services. GUC is committed to providing the most advanced and best price-performance silicon solutions through close partnerships with TSMC, a major GUC shareholder, and other key packaging and testing powerhouses. With state-of-the-art EDA tools, advanced methodologies and an experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC has established a global customer base throughout Greater China, Japan, Korea, North America and Europe. Its track record in complex SoC designs benefits customers in time-to-revenue at the lowest risk.