IC Design Consultancy Sondrel completes 3rd successful 28nm tape out this year - more to follow
Activity convinces company that 28nm will be sweet spot for complex designs for some time to come
THEALE, England -- Mar 14, 2013 -- Sondrel, one of the world's leading system-to-silicon IC design consultancies, has just completed its third 28nm design this year - for a leading communications company - and is closing on two more at this node. Although Sondrel has worked on over 200 IC designs at all nodes down to 20nm, and chip sizes over 700mm(2), the fact that the company has so many successful tape-outs at 28nm convinces CEO Graham Curren that 28nm will be the preferred geometry for complex chips for some time to come.
He explains: "As an independent design consultancy we have customers in all sectors - mobile, computing, graphics, consumer, automotive - so it is interesting that so many of our projects are based around 28nm. We think this is perhaps because 28nm appears to be a strong, stable process with good yield and performance characteristics, and is therefore more attractive than 40nm or the still new 20nm node. Our holistic approach - where we consider manufacturability from the outset rather than as a separate activity later - pays dividends at all nodes, especially at 28nm and below, where there are a lot of new DFM requirements, and where you simply can't afford to ignore production issues early on."
Sondrel is a TSMC Design Centre Alliance (DCA) partner and the leading IC foundry's recent earning release supports Sondrel's 28 nanometer viewpoint, announcing that "shipments of 28 nanometer process technology reached 22% of total wafer revenues". Sondrel is also approved by SMIC - the consultancy is one of a very few such companies to be approved by both SMIC and TSMC - and has strong relationships with EDA tools vendors, IP suppliers and other foundries, resulting in a very strong design supply chain.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
Related News
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
- ARM and Cadence Tape Out First 14nm FinFET Test Chip Targeting Samsung Process
- Cadence Solutions Enable Successful Tape Out of 20-Nanometer SoC Test Chip by Global Unichip Corporation
Latest News
- Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries
- Aion Silicon Successfully Completes ISO 9001 and ISO/IEC 27001 Surveillance Audit, Strengthening Commitment to Quality and Security
- Baya Systems Awarded Globally Recognized ISO 9001:2015 Certification for Quality Management by TÜV Rheinland
- Si2 Announces Creation of the Si2 LLM Benchmarking Coalition
- Qualitas Semiconductor Signs Licensing Agreement with Chinese SoC Company for DSI-2 Controller and MIPI PHY IP