Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern
Kaiserslautern, Germany, January 08, 2024 – Creonic GmbH is pleased to announce its official membership as a supporting partner of the Science and Innovation Alliance Kaiserslautern (SIAK). This collaboration underlines Creonic's commitment to fostering innovation and scientific progress within the region.
SIAK is a consortium of leading companies, research institutions, and educational establishments in Kaiserslautern, focused on enhancing collaboration between industry and academia. As a supporting member, Creonic will actively participate in initiatives aimed at supporting technology transfer and innovation in the region.
"Becoming a member of the Science and Innovation Alliance Kaiserslautern strengthens our ties to the local science and technology community," declared Timo Lehnigk-Emden, CEO of Creonic GmbH. "We look forward to working together on projects that have the potential to shape the technology landscape in our region sustainably."
This partnership provides Creonic with the opportunity to share its expertise and resources with other SIAK members and collaboratively develop innovative solutions. By working closely with research institutions and companies in Kaiserslautern, Creonic aims to contribute to strengthening the regional innovation ecosystem.
Creonic GmbH is eager to collaborate with SIAK and believes that this partnership will contribute significantly to boosting the region's innovation capabilities and competitiveness.
Related Semiconductor IP
- USB 20Gbps Device Controller
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
- Bluetooth Low Energy Subsystem IP
- Multi-core capable 64-bit RISC-V CPU with vector extensions
Related News
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
- Ausdia Joins TSMC Open Innovation Platform® (OIP) EDA Alliance
Latest News
- Signal Edge Solutions Joins AMD Embedded Partner Program
- MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
- RISC-V: Shaping the Future of Mobility with Open Standards and Strong Partnership
- ARTE Debuts New MPEG-H Dialog+ Feature
- Omni Design Technologies Secures over $35 Million in Series A Funding to Advance Its Leadership in Wideband Signal Processing™ for the AI Data Revolution