Commentary: Get ready for 450-mm fabs
Bill McClean, President of IC Insights Inc.
(10/24/2007 8:03 AM EDT) -- EE Times
IC industry equipment and material suppliers have recently voiced concern regarding the potential move from 300mm wafers to 450mm wafers for the production of ICs.
Demand Side
Some have even stated that this transition is unlikely to ever happen! IC Insights strongly disagrees with this outlook. Although movement to 450mm wafers is not ''just around the corner,'' IC Insights believes that it is only a matter of when, not if, it takes place. IC equipment and materials suppliers may be reluctant participants in 450mm wafer production, but it will happen!
One of the main arguments for moving to 450mm wafers is the reduction of processing cost on a per-square-inch basis. Since the beginning of the IC industry, increasing the wafer size has been an important element in reducing the processing cost per square inch of silicon.
Currently, no IC supplier is even close to optimizing the high-volume manufacturing cost structure for the relatively new 300mm wafer size. However, the idea/dream that 450mm wafers will ultimately be even more cost efficient is one that will not go away.
(10/24/2007 8:03 AM EDT) -- EE Times
IC industry equipment and material suppliers have recently voiced concern regarding the potential move from 300mm wafers to 450mm wafers for the production of ICs.
Demand Side
Some have even stated that this transition is unlikely to ever happen! IC Insights strongly disagrees with this outlook. Although movement to 450mm wafers is not ''just around the corner,'' IC Insights believes that it is only a matter of when, not if, it takes place. IC equipment and materials suppliers may be reluctant participants in 450mm wafer production, but it will happen!
One of the main arguments for moving to 450mm wafers is the reduction of processing cost on a per-square-inch basis. Since the beginning of the IC industry, increasing the wafer size has been an important element in reducing the processing cost per square inch of silicon.
Currently, no IC supplier is even close to optimizing the high-volume manufacturing cost structure for the relatively new 300mm wafer size. However, the idea/dream that 450mm wafers will ultimately be even more cost efficient is one that will not go away.
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related News
- Commentary / Analysis: Real men have fabs, but maybe not Infineon, NXP, TI and ST.
- Siroyan multiprocessor to get CoSy compiler treatment
- NEC steps up timetable to build two 300-mm fabs
- Xilinx FPGAs get CoreEl, Memec controller cores
Latest News
- AI Directs UFS Advancement
- Qualitas Semiconductor Expands Automotive Momentum with 5nm IP Bundle Agreement
- Cyient Semiconductors Acquires Majority Stake in Kinetic Technologies to Drive Custom Power IC Leadership for Edge AI and High-Performance Compute Markets
- Rivian Unveils Custom Silicon, Next-Gen Autonomy Platform, and Deep AI Integration
- NanoXplore raises €20 million from MBDA and Bpifrance to accelerate its diversification into defense and its growth in support of European strategic sovereignty