NEC steps up timetable to build two 300-mm fabs
NEC steps up timetable to build two 300-mm fabs
By Jack Robertson, Semiconductor Business News
April 21, 2000 (10:39 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000421S0006
WASHINGTON -- Not wanting to be left out of the limelight, NEC Corp. today moved a little closer to getting its previously announced 300-mm wafer fabs underway. The Japanese chip maker said construction of the two fab shells will begin within 12 months, although there are no plans about yet when to start equipping the plants. Two years ago, NEC said it planned to build its first 300-mm fab in Hiroshima, followed by a second, larger-size wafer fab adjoining its present Roseville, Calif., plant. But as recently as last month, NEC chairman Hajime Sasaki said there was still no definite timetable for launching the two new fabs. Analysts said NEC is pondering the financing for the costly new fabs, on top of an already aggressive new capital investment schedule. In the last week alone, NEC has announced a $978 million new fab in Yamaguchi to make system-on-chip ICs and a $340 million upgrade to its Scotland fab to make flat panel display driver chips. NEC is also poised to expand its Kyushu fab to make embedded memory chips for the next generation Nintendo game player called Dolphin.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- China to build five 300-mm wafer fabs by 2006
- China to build 20 new fabs by 2008
- NEC shuts fabs, exits structured ASICs
- Crocus Technology Strikes $300 Million Financing Deal with RUSNANO to Build Advanced MRAM Manufacturing Facility in Russia
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack