China Gears Up for Chip Dumping, Ex-DoC Official Says
By Alan Patterson, EETimes (September 26, 2023)
China’s government has used dumping to destroy overseas tech industries and take them over, former Department of Commerce (DoC) Under Secretary Nazak Nikakhtar told EE Times. The next targets are legacy chips and electric vehicle (EV) batteries, she predicted.
Nikakhtar began her career at DoC’s Bureau of Industry and Security (BIS) just after China joined the World Trade Organization (WTO) in 2001. She had just started seeing “systematic practices” by China that “hollowed out” U.S. tech industries. The October 2022 export control rules of the U.S. that are aimed at slowing China’s advance into leading-edge semiconductor nodes have failed, she said.
To read the full article, click here
Related Semiconductor IP
- UCIe Chiplet PHY & Controller
- MIPI D-PHY1.2 CSI/DSI TX and RX
- Low-Power ISP
- eMMC/SD/SDIO Combo IP
- DP/eDP
Related News
- MIPS lands up in China
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
- US extends China chip ban
Latest News
- Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications
- Digital Core Design Unveils DPSI5 - The Next-Generation IP Core for PSI5 Communication
- Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025
- HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
- TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025