China Gears Up for Chip Dumping, Ex-DoC Official Says
By Alan Patterson, EETimes (September 26, 2023)
China’s government has used dumping to destroy overseas tech industries and take them over, former Department of Commerce (DoC) Under Secretary Nazak Nikakhtar told EE Times. The next targets are legacy chips and electric vehicle (EV) batteries, she predicted.
Nikakhtar began her career at DoC’s Bureau of Industry and Security (BIS) just after China joined the World Trade Organization (WTO) in 2001. She had just started seeing “systematic practices” by China that “hollowed out” U.S. tech industries. The October 2022 export control rules of the U.S. that are aimed at slowing China’s advance into leading-edge semiconductor nodes have failed, she said.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
Related News
- MIPS lands up in China
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
- China Bets on Homegrown Chip Tech With RISC-V Push
Latest News
- Virtusa Acquires Bengaluru based SmartSoC Solutions, Establishing Full-Stack Service Offering from Chip to Cloud and Driving Expansion into the Semiconductor Industry
- Consumer Electronics and AI Product Launches Lift 3Q25 Top-10 Foundry Revenue by 8.1%, Says TrendForce
- Joachim Kunkel Joins Quadric Board of Directors
- RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper
- SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary