CEO Interview: Ian Lankshear, EnSilica
By Nick Flaherty, eeNews Europe
Securing the semiconductor supply chain with ASICs
UK chip designer EnSilica is looking to capitalise on the increasing drive for car makers and large industrial companies to develop their own chips.
The pandemic highlighted the importance of the semiconductor supply chain, and this is driving a renaissance in the custom ASIC business, Ian Lankshear, CEO of EnSilica tells Nick Flaherty during Embedded World 2023.
“In 2016 we made the decision that what we wanted to do was to scale the business by selling chips rather than time,” said Lankshear. “We’ve been through the route of developing IP and licensing. Where you really scale is the fabless ASIC model – we are making custom chips and a lot of those chips will include some of our IP, its about differentiation and knowhow, radar, cryptography, RF, analog IP and if you come to the game with an empty toolbox you are at a disadvantage.”
To read the full article, click here
Related Semiconductor IP
- CAN XL Verification IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- Neuromorphic Processor IP
Related News
- CEO interview: S3 Semi ready for custom opportunity
- CEO interview: Flex Logix' Geoff Tate on licensing FPGA
- CEO interview: The importance of being agile
- CEO interview: Globalfoundries' Tom Caulfield on the European project
Latest News
- SiFive’s New RISC-V IP Combines Scalar, Vector and Matrix Compute to Accelerate AI from the Far Edge IoT to the Data Center
- Siemens Joins the CHERI Alliance: a United Front for Cutting-Edge Cybersecurity
- Comcores Launches OmniGate: A Versatile and Compact Hardware Evaluation Platform for TSN Ethernet End Stations, Switches, and Gateways
- Logic Design Solutions Announces Gen 5 NVMe Host IP on AGILEX 7 R-Tile
- Global Semiconductor Sales Increase 20.6% Year-to-Year in July