Cadence Design Services adds BOPS, Inc. to the Cadence Surelink Supply-Chain Network
Cadence Design Services adds BOPS, Inc. to the Cadence Surelink Supply-Chain Network
SAN JOSE, Calif. - June 5, 2000 - Cadence Design Systems, Inc. (NYSE: CDN), the world's leading supplier of electronic design products and services, announced today that it has expanded its Cadence® Design Services SureLink supply-chain network with BOPS®, Inc., a developer and licensor of high-performance, scalable, reusable, programmable digital signal processor (DSP) intellectual property (IP) cores. The SureLink program integrates the offerings of multiple electronic-system and integrated circuit supply-chain providers with those of Cadence Design Services to provide superior solutions to mutual customers.
BOPS' synthesizable ManArray[tm] DSP IP is aimed at Cadence Design Services target markets of wireless communications, Internet-enabled devices, and multimedia. Now, clients in these markets have the opportunity to leverage both BOPS IP and Cadence's system-on-chip (SOC) design services, with a supply-chain path from design to manufactured chip.
"The expansion of our portfolio of innovative IP with BOPS ManArray[tm] enhances our IP integration offerings for clients in several high-growth markets," said Ajay Shingal, vice president and general manager of Cadence Design Services Digital Integrated Circuit Design Group.
"BOPS ManArray[tm] is targeted to quickly integrate into an SOC with multiple complementary IP such as ARM[tm] and MIPS® embedded processor cores," said Rick Kepple, vice president of marketing, BOPS, Inc. The SureLink supply chain relationship provides a technical framework for us, as IP licensors, and Cadence Design Services to supply mutual clients with the optimum SOC solution. This program is another quick and efficient way for OEM's to complete their DSP semiconductor value chain and utilize the BOPS ManArray[tm] architecture to meet their high-performance, scaleable, reusable and programmable DSP requirements."
About Cadence
Cadence is the largest supplier of software products, methodology services and design services used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics and a variety of other electronics-based products. With approximately 5,000 employees and 1999 annual revenue of $1.1 billion, Cadence has sales offices, design centers and research facilities around the world. The Company is headquartered in San Jose, Calif. Further information may be found on the World Wide Web at http://www.cadence.com.
About BOPS
BOPS, Inc. (Billions of Operations Per Second, Inc.) is a California-based company that develops and licenses high-performance, scalable and reusable programmable DSP cores, and world-class compiler and software tool products - for high-volume, SOC-based applications targeted at the Internet, multimedia and wireless communications markets. BOPS ManArray[tm] digital-signal processor cores accelerate the time from product-concept to high-volume shipment for SOC manufacturers. The ManArray[tm] technology is designed to integrate with MIPS® and ARM[tm] processor-based SOC's. Further information may be found on the World Wide Web at http://www.bops.com.
Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. ManArray and ARM are trademarks; and BOPS® and MIPS are registered trademarks of BOPS, Inc. All other trademarks are property of their respective owners.
For more information, please contact:
Andy Foster Cadence Design Systems, Inc.
408-944-7684
afoster@cadence.com
Darryl Lloyd Darryl Lloyd, Inc.
818-551-7360, Ext. 11
darryl@dlloyd.com
Related Semiconductor IP
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
- UCIe RX Interface
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
Related News
- ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal
- Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity
- AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
Latest News
- SEMIFIVE Pulls Ahead in AI ASIC Market, Expanding Lead with Successive NPU Project Wins
- M31 Reports Record NT$1.78 Billion Revenue in 2025 as Advanced Node Royalties Begin to Emerge
- Silvaco Reports Fourth Quarter and Full-Year 2025 Financial Results
- Klepsydra Technologies and BrainChip Announce Strategic Partnership to Deliver Heterogeneous AI Runtime for Akida™ Neuromorphic Processors
- Alchip Reports ASIC-Leading 2nm Developments