Arm Gives Glimpse of AI Core
One smartphone maker beta testing RTL
Rick Merritt, EETimes
5/22/2018 05:00 AM EDT
AUSTIN, Texas — Arm sketched the inner workings of its machine-learning core at a press and analyst event here. Engineers are nearly finished with RTL for the design with hopes of snagging a commitment within weeks for use in a premium smartphone in 2019 or later.
Analysts generally praised the architecture as a flexible but late response to a market that is already crowded with dozens of rivals. However, Arm still needs to show detailed performance and area numbers for the core, which may not see first silicon until next year.
The first core is aimed at premium smartphones that are already using AI accelerator blocks from startup DeePhi (Samsung Galaxy), Cambricon (Huawei Kirin), and in-house designs (iPhone). The good news for Arm is that it’s already getting some commercial traction for the neural-networking software for its cores, released as open source, that sits under frameworks such as TensorFlow.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Edgewater Wireless Initiates Prototyping of AI Subsystem Powered by Arm Technology
- Silvaco Expands Product Offerings in Photonics and Wafer-Scale Plasma Modeling for AI Applications with Acquisition of Tech-X Corporation
- Enabled on makeChip and powered by Racyics, the SpiNNaker2 chip forms the core of the newly launched SpiNNcould supercomputer!
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
Latest News
- Weebit Nano Joins EDGE AI FOUNDATION to Advance Intelligent Systems at the Edge
- Credo Launches 224G PAM4 SerDes IP on TSMC N3 Process Technology
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
- Aura Semiconductor Announces Vcore Power Technology Transaction with onsemi
- GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC’s Latest 3DFabric® and Advanced Process Technologies