Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs)
2020-11-23 13:09:00
SoC Architecture & Assembly
Chiplet News Archive - Page 340 of 1945
North American Semiconductor Equipment Industry Posts October 2020 Billings
2020-11-23 10:25:00
Analysis & Insight
Mythic launches industry-first AI analog matrix processor
2020-11-23 09:21:00
SoC Architecture & Assembly
Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign
2020-11-20 08:45:00
IP Cores & Design
AI Startup Deep Vision Powers AI Innovation at the Edge
2020-11-19 14:02:00
SoC Architecture & Assembly
Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention
2020-11-19 13:54:00
SoC Architecture & Assembly
Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
2020-11-19 13:51:00
Strategic Partnerships
Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI
2020-11-19 13:44:00
SoC Architecture & Assembly
Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications
2020-11-19 13:30:00
Strategic Partnerships
SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge
2020-11-19 09:57:00
Commercial Deals
Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification
2020-11-19 07:57:00
Strategic Partnerships
Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products
2020-11-18 15:45:00
Commercial Deals
Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce
2020-11-18 15:08:00
Analysis & Insight
Wafer Capacity by Feature Size Shows Strongest Growth at <10nm
2020-11-18 13:05:00
Analysis & Insight
Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands
2020-11-18 13:02:00
Misc
First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
2020-11-18 12:49:00
SoC Architecture & Assembly
BrainChip Appoints Todd Vierra Director of Technical Sales
2020-11-18 12:46:00
People & Leadership
Kandou Raises $92.3 Million in Series C Funding
2020-11-17 15:27:00
Strategic Partnerships
GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
2020-11-17 07:20:00
IP Cores & Design
Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications
2020-11-17 07:09:00
Commercial Deals