Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud
2021-12-01 17:25:00
EDA
Chiplet News Archive - Page 265 of 1936
Agnisys Delivers Novel AI Technology and FPGA Support for IP and SoC Specification Automation
2021-12-01 15:09:00
EDA
Flex Logix Joins the Edge AI and Vision Alliance
2021-12-01 14:43:00
Other
First SoC ever to pass CC EAL5+ certification thanks to Tiempo Secure TESIC Secure Element IP
2021-12-01 13:56:00
People
Arteris Announces Financial Results for the Third Quarter 2021 and Estimated Fourth Quarter and Full Year 2021 Guidance
2021-12-01 13:50:00
Financial
Arasan Chip Systems announces Immediate availability of MIPI I3C PHY I/O IP
2021-12-01 13:34:00
IP
LeapMind Announces Efficiera v2 Ultra-Low Power AI Inference Accelerator IP
2021-12-01 13:24:00
IP
videantis achieves Automotive SPICE Level 2 certification
2021-12-01 09:27:00
IP
IAR Systems and Codasip collaborate to enable low-power RISC-V based applications
2021-11-30 15:06:00
Embedded Systems
CEO interview: Minima's Tuomas Hollman on why static timing sign-off is over
2021-11-30 10:02:00
Commentary / Analysis
MIPS selects Imperas Reference Models for RISC-V Processor Verification
2021-11-30 08:44:00
EDA
Micron and UMC Announce Global Settlement
2021-11-30 07:38:00
Legal
Key ASIC Signed LOI to Acquire Wafer FAB in The US
2021-11-30 05:31:00
Business
Silicon Catalyst Partners with Sony Semiconductor Solutions to Accelerate Semiconductor Startups
2021-11-29 17:07:00
Other
Synopsys Expands Use of AI to Optimize Samsung's Latest Mobile Designs
2021-11-29 15:44:00
EDA
Profile of a traceability tool promising automation in SoC designs
2021-11-29 11:04:00
Commentary / Analysis
intoPIX Unveils "TicoXS FIP" During its ProAV Virtual Event This Week
2021-11-29 09:15:00
IP
USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing
2021-11-29 06:23:00
Other
Samsung Selects Texas as Site for $17 Billion Fab
2021-11-25 16:46:00
Commentary / Analysis
Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement
2021-11-25 16:45:00
Other