USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP in 12nm, 16nm and 22nm process nodes with simple integration and flexible customization is ready for immediate licencing for your advanced SoC design
2022-02-07 02:28:00
Misc
Chiplet News Archive - Page 262 of 1945
Synaptics Launches Industry's First Matter-Compliant Triple Combo SoC with Integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread for Seamless IoT Connectivity
2022-02-03 16:35:00
SoC Architecture & Assembly
Rain Neuromorphics Raises $25M Series A to Transform AI Hardware Landscape
2022-02-03 16:35:00
Strategic Partnerships
How to Interpret Chip Supply Chain Data
2022-02-03 16:35:00
Analysis & Insight
eTopus Announces Collaborative IP Platform for Rapid and Economical Deployment of Chiplets
2022-02-02 15:19:00
IP Cores & Design
France: EIB lends €7.5 million to Menta to speed up its development
2022-02-02 14:31:00
Strategic Partnerships
NSCore, Inc. Introduces its Automotive Grade-1 Qualified Non-Volatile Memory solution to help address the increasing need for Low Cost Semiconductor Chips
2022-02-02 11:26:00
IP Cores & Design
eDisplay Port / Display Port v1.4 Tx PHY and Controller IP in 40ULP and 12FFC process nodes for lagless and pure UHD Displays is available for immediate licensing
2022-02-02 11:02:00
Misc
BrainChip Awarded US Patent for Accessing Learned Functions in an Intelligent Target Device
2022-02-02 07:38:00
Legal & IP Strategy
DSP Concepts Secures $28M in Series C Funding to Fuel Rapid Growth
2022-02-02 06:41:00
Strategic Partnerships
Codasip appoints Functional Safety VP
2022-02-02 05:03:00
People & Leadership
Mixel MIPI C-PHY/D-PHY Combo IC Integrated in isMedia Frame Grabber Family of Products for Sensor Applications
2022-02-01 17:14:00
Commercial Deals
AMD Acquisition of Xilinx Heats Up Competition with Intel
2022-01-31 15:00:00
Analysis & Insight
Arasan expands Total MIPI Display IP with seamlessly integrated VESA DSC IP
2022-01-31 08:33:00
IP Cores & Design
LeapMind Announces AI Image processing model which operates on edge devices
2022-01-31 08:19:00
IP Cores & Design
GOWIN Semiconductor USB 2.0 PHY Interface and Device Controller IPs Achieve USB-IF Certification
2022-01-31 06:43:00
SoC Architecture & Assembly
Samsung Readies Gate-All-Around Ramp
2022-01-31 02:42:00
Analysis & Insight
CAES Collaborates with Lattice Semiconductor to Provide Radiation-Tolerant FPGAs for Distributed Satellite Computing Applications
2022-01-31 01:24:00
SoC Architecture & Assembly
Logic Design Solutions Launches NVME Host IP on Xilinx Ultrascale & Ultrascale Plus FPGA
2022-01-28 10:25:00
IP Cores & Design
Blue Danube Systems Enters Agreement to Be Acquired by NEC Corporation
2022-01-28 09:21:00
Strategic Partnerships