Microsemi IP

RISC-V based MIPI I3C master interface has been developed to ease sensor system design architectures in mobile wireless products by providing a fast, low cost, low power, two-wire digital interface for sensors
All the basic functionalities of MIPI I3C master has been proved with Microsemi smart fusion 2 creative development board .In addition the MIPI I3C master supports for both AHB lite and APB Interface

The SHA-384/512 is a high-throughput, and compact hardware implementation of the SHA-384 and the SHA-512 cryptographic hash functions provisioned by the FIPS180-4 standard.
The core is designed for ease of use and integration and adheres to industry-best coding and verification practices.

16 state CCSDS compatible
Rate 1/2, 1/3, 1/4 or 1/6
Interleaver sizes from 1784 to 16056 bits
Includes optional automatic synchronisation to non-inverted or inverted sync marker, optional descrambler and ping-pong input memory

The AXI-SBS is an integrated, verified, AMBA® compliant hardware/software system ready for embedded applications using processors with AXI4 interfaces such as the BA20, BA21, and several RISC-V Implementations.
The AXI Subsystem combines peripheral and interface IP cores with drivers and other essential software and an AXI/APB bus infra- structure.

The AHB-SBS is an integrated, verified, AMBA® 3.0 interconnect and peripherals subsystem ready for embedded applications using processors with AHB bus interfaces such as the BA22-DE, BA22-CE, ARM Cortex-M0/M0+/M1/M3/M4, and several RISC-V processors.
The AHB subsystem is available in two versions

The APB-SBS subsystem integrates typical microcontroller peripherals connected on the an AMBA® APB bus with a bridge to AHB or AXI bus.
The subsystem is ready for integration with processors having either an AHB or an AXI interface such as the BA2x processors, and several ARM Cortex and RISC-V processors.
The peripherals connect to the 32-bit APB ports of the APB bridge, which allows configuring the base address and the size of the address space for each peripheral. The subsystem includes the following modules: