Floadia IP
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Embedded flash IP, 1.8V/5V TSMC 180nmBCD
- Supports high temperature and long retention life time for severe automotive requirement
- Low power in Program/Erase operation for power critical applications
- Requires few (2~3) additional masks
- No change to SPICE model of Standard CMOS process, for re-using existing design and IP
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Embedded flash IP, 1.5V/5V SMIC 90nmBCD
- Supports high temperature and long retention life time for severe automotive requirement
- Low power in Program/Erase operation for power critical applications
- Requires few (2~3) additional masks
- No change to SPICE model of Standard CMOS process, for re-using existing design and IP
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Embedded flash IP, 1.5V/5V 130nm
- G1 is cost effective embedded flash IP to support from medium density to 100KBytes
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Embedded flash IP, 1.5V/5V 130BCD Plus
- Supports high temperature and long retention life time for severe automotive requirement
- Low power in Program/Erase operation for power critical applications
- Requires few (2~3) additional masks
- No change to SPICE model of Standard CMOS process, for re-using existing design and IP
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Zero Additional Mask MTP IP, 2.2-5V 4kbit HHGrace 180BCD
- High Temperature Operation
- Large Program Size enables Short Testing Time
- Low Cost
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Next Generation Flash device enabling small size, low power and direct connection with digital circuit which opens up new possibiities
- small size
- low power
- direct connection with digital circuit
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Embedded flash IP, 1.32V/3V PSMC 90nm
- Supports high temperature and long retention life time for severe automotive requirement
- Low power in Program/Erase operation for power critical applications
- Requires few (2~3) additional masks
- No change to SPICE model of Standard CMOS process, for re-using existing design and IP
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Zero Additional Mask MTP
- Up to 1kB densities
- Up to 100k P/E cycles
- No additional mask required