Ethernet 802.3ck IP
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14
IP
from 3 vendors
(1
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10)
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Simulation VIP for Ethernet up to 800G
- 800Gbps Interfaces
- 800Gbps Ethernet interfaces based on Ethernet Technology Consortium supports:
- 800GMII
- 800GBase-R Dual-PCS 32 lanes (25Gb/s)
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100G MAC/PCS Ultra Ethernet
- The IP integrates MAC Layer, RS Sub-Layer and 100G PCS Base-R cores according to IEEE 802.3 standard to provide seamless connection between an application and serdes interfaces
- 128-bit interface for TX and RX between MAC and the application Serdes interface – configurable to support PAM2 and PAM 4
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112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N6 x1, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N5 x4, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N3P x4 1.2V, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet LRM PHY, TSMC N3P x4, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
