3D I/O IP
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12
IP
from 7 vendors
(1
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10)
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PCIe-NVMe SSD Controller Platform
- Compliant to NVMe specification (pass UNH-IOL compliance test)
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Quad channel ADAS IP platform
- Can cut design cost and time to market by up to 30%.
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HDMI 2.0b IP Core
- HDMI 2.0b and 1.4a Compatible
- 8,10,12 & 16 bit Deep-color support
- 1-,2- or 4- symbol/pixel per clock input/output
- Supports RGB, YCbCr Colorimetric Formats
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TSMC N3P Source Sync 3DIO PHY
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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TSMC N3P Source Sync 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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TSMC N3P 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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TSMC N5 Source Sync 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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Synopsys Synthesizable 3DIO IP for Flexible Physical Implementation
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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3DIO PHY IP for TSMC N5
- Optimized for heterogeneous integration in 3D stacking
- TSMC N5