3d i/o IP

As a part of the Video and Vision Processing (VVP) Suite Intel® FPGA IP, the 3D look-up table (LUT) Intel® FPGA IP provides an efficient solution for video color space and dynamic range conversions, chroma keying, and the creation of artistic effects.

D/AVE NX is the latest and most powerful addition to the D/AVE family of rendering cores.
It is the first IP to bring 3D graphics OpenGL ES 2.0 rendering (with some ES 3.0 / 3.1 extensions) to the FPGA and SoC world and – with offline-shader compilers – even into MCUs or low-end MPUs with small amounts of memory and bare-metal or RTOS operation systems.

The J5 is a core cell design of an application specific signal processor which performs both Trusurround(TM) and SRS® 3-D audio virtualization processing in a single design.
The 3-D processing allows users to enjoy benefits of a multi-channel sound source with only two reporduction channels.

The PCIe-NVMe SSD controller platform is compliant with NVM Express 1.2 specification and targets for both enterprise and client SSD markets.
It features YEESTOR's NVMe controller core and LDPC error correction core to enable low-power and cost-effective SSD controllers that support 1x/1y/1z MLC/TLC and 3D NAND.

Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration

Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration

Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration

Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration

3D I/O IP