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112G Long-Reach SerDes IP

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Compare 45 IP from 3 vendors (1 - 10)
  • 112G PHY, TSMC N7 x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G PHY, TSMC N7 x4, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N6 x1, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N6 x1, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N5 x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N5 x4, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N3P x4 1.2V, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N3P x4 1.2V, North/South (vertical) poly orientation
  • 112G Ethernet LRM PHY, TSMC N3P x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet LRM PHY, TSMC N3P x4, North/South (vertical) poly orientation
  • Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
    • 16-lane TX and RX square macros for placement in any edge of the die
    • Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
    • Implements NRZ and PAM-4 signaling
    • Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
    Block Diagram -- Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
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