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TSMC N3P 1.2V High-Speed Test IO
- The AI and HPC industries are advancing toward chiplet-based designs to achieve superior performance, as traditional monolithic SoCs face scaling challenges
- Heterogeneous integration is driving semiconductor innovation but adds complexity to chip design, requiring advanced testing methodologies and improved Automated Test Equipment (ATE)
- Increasing test patterns and limited package pins demand high-bandwidth IOs, while advancements in ATE capabilities further necessitate optimized GPIOs to support higher-speed, efficient and low-cost testing
- Synopsys High-Speed Test IO IP is a cutting-edge IO interface solution that enables efficient, high-speed testing of complex semiconductor designs while minimizing hardware complexity and cost
