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3DIO IP for TSMC

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Compare 6 3DIO IP for TSMC from 1 vendors (1 - 6)
  • TSMC N5 Source Sync 3DIO PHY
    • Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
    • It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
    • The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
    • Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
  • TSMC N3P Source Sync 3DIO PHY
    • Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
    • It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
    • The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
    • Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
  • TSMC N3P Source Sync 3DIO Library
    • Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
    • It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
    • The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
    • Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
  • TSMC N3P 3DIO Library
    • Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
    • It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
    • The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
    • Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
  • TSMC N5 Source Sync 3DIO Library
    • Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
    • It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
    • The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
    • Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
  • TSMC N5 3DIO Library
    • Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
    • It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
    • The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
    • Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
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