Why Sidense OTP is Like the Armored Car of NVM
September 24, 2015
I have written about Sidense before, but last week at the TSMC Open Innovation Platform Forum, I had a chance to hear a talk by, and have lunch with Betina Hold Director of R&D at Sidense. Here is what I learned.
Sidense has been focusing on the growing market in what they like to call the smart connected universe. It is best to think of this as the union of mobile, IoT, wearables, medical, industrial and automotive. Incidentally Automotive was a hot topic at the OIP Forum.
To read the full article, click here
Related Semiconductor IP
- OTP
- Secure OTP
- 64x1 Bits OTP (One-Time Programmable) IP, TSMC 0.18um SiGe BiCMOS 1.8V/3.3V General Purpose Process
- 8Kx16 Bits OTP (One-Time Programmable) IP, DB HiTek AN180 1.8V / 5V Process
- 8Kx8 Bits OTP (One-Time Programmable) IP, MXIC 0.18um 1.8V/5V Logic/BCD Process
Related Blogs
- Why SRAM PUF Technology Is the Bedrock of Dependable Security in Any Chip
- The Future of Driving: How Advanced DSP is Shaping Car Infotainment Systems
- Connected AI is More Than the Sum of its Parts
- What really means high reliability for OTP NVM?
Latest Blogs
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines
- Automotive Reckoning: Industry Leaders Discuss the Race to Redefine Car Development