Why Sidense OTP is Like the Armored Car of NVM
I have written about Sidense before, but last week at the TSMC Open Innovation Platform Forum, I had a chance to hear a talk by, and have lunch with Betina Hold Director of R&D at Sidense. Here is what I learned.
Sidense has been focusing on the growing market in what they like to call the smart connected universe. It is best to think of this as the union of mobile, IoT, wearables, medical, industrial and automotive. Incidentally Automotive was a hot topic at the OIP Forum.
To read the full article, click here
Related Semiconductor IP
- OTP
- Secure OTP
- 64x1 Bits OTP (One-Time Programmable) IP, TSMC 0.18um SiGe BiCMOS 1.8V/3.3V General Purpose Process
- 8Kx16 Bits OTP (One-Time Programmable) IP, DB HiTek AN180 1.8V / 5V Process
- 128x16 Bits OTP (One-Time Programmable) IP, DBHitek 0.13um BCD Process Platforms
Related Blogs
- Why SRAM PUF Technology Is the Bedrock of Dependable Security in Any Chip
- The Future of Driving: How Advanced DSP is Shaping Car Infotainment Systems
- NVMe-MI 1.1: Why Manageability is Critical for Today's Enterprise Storage Demands
- Windows on Arm is Ready for Prime Time: Native Chrome Caps Momentum for the Future of Laptop Computing
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms