No More Cheap Wafers, says Future Horizons
Leading edge capacity will never again be a commodity. Recent trends are making manufacturing more valuable and scarce, according to Future Horizons whose IEF 2011 conference in Seville started this morning.
The trend to go fabless at 65nm, the trend to $3bn fabs reducing the number of IDMs and foundries which can afford them, the trend for capacity to lag demand rather than lead it, and the trend to 450mm, are combining to make leading edge capacity limited, expensive and tight.
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
Related Blogs
- Wafer Prices Rising As Supply Lags Demand
- TSMC Wafer Allocation and Design Migration
- DDR3/DDR2 price crossover reached
- What's happening on the 450mm wafer front?
Latest Blogs
- Breaking the Silence: What Is SoundWire‑I3S and Why It Matters
- What It Will Take to Build a Resilient Automotive Compute Ecosystem
- The Blind Spot of Semiconductor IP Sales
- Scalable I/O Virtualization: A Deep Dive into PCIe’s Next Gen Virtualization
- UEC-LLR: The Future of Loss Recovery in Ethernet for AI and HPC