Leading the Charge: Cadence Announces New Verification IP for UFS 3.0, CoaxPress, and HyperRAM
Today, Cadence announced three new VIPs, two of which are industry-firsts! Cadence revealed the first available VIP for CoaXPress for high-speed imaging and the first available VIP for HyperRAM high-speed memory. We also unveiled a new JEDEC Universal Flash Storage 3.0 (UFS) VIP. Together, these three new VIPs allow early-adopters to leap off the starting line in the race to create new, incredible SoCs and IPs incorporating these revolutionary new technologies.
To read the full article, click here
Related Semiconductor IP
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- All Digital Fractional-N RF Frequency Synthesizer PLL in GlobalFoundries 22FDX
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
Related Blogs
- JEDEC UFS 3.0 Now Available in Cadence VIP Portfolio - For Mobile and Automotive Markets
- Synopsys Introduces the Industry's First Verification IP for Arm AMBA 5 CHI-F
- Synopsys TileLink Interconnect Verification IP for RISC-V SoCs
- AI-Based Sequence Detection for IP and SoC Verification & Validation
Latest Blogs
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines
- Automotive Reckoning: Industry Leaders Discuss the Race to Redefine Car Development