How Long Does it Take to Go From a Muddy Field to Full 28nm Capacity?
TSMC has a lot of capacity. Not just that, it has a lot more under construction. It currently has 3 300mm Gigafabs, fabs 12,14 and 15 (there doesn't seem to be a 13). This morning, Dr Wang, who is TSMC's VP of 300mm operations told us about the expansion plans. Currently fab 15 phase 3 and 4, and fab 13 phase 3 are to be ramped this year. Four more phases are under construction. Fab 14 phases 5, 6 and 7. And fab 12 phase 7. TSMC used to construct roughly one phase per year, now it builds 3. With all this capacity the will ramp to 13.5M wafers (8" equivalents). Capacity in advanced nodes will double in advanced nodes (sub 45nm).
The ramp of 28nm into volume production was the fastest TSMC has ever done. 20nm/16nm will ramp even faster. Of course this is driven partially by the steep ramps and short product cycles of the mobile industry. Fabs 12/14 have thousands of engineers already preparing for that ramp.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
Related Blogs
- Microsoft Plans To Tie IC-Makers To One-Tablet-Per-IC-Design
- GlobalFoundries' Expansion on Hold! Trouble in Abu Dhabi?
- Intel's Foundry Plans
- The best laid plans of mice and men
Latest Blogs
- Enabling End-to-End EDA Flow on Arm-Based Compute for Infrastructure Flexibility
- Real PPA improvements from analog IC migration
- Design specification: The cornerstone of an ASIC collaboration
- The importance of ADCs in low-power electrocardiography ASICs
- VESA Adaptive-Sync V2 Operation in DisplayPort VIP