TSMC: Enabling Startups to Unleash New Semiconductor Innovation
Semiconductor innovation empowers products for nearly all other industries, such as smartphones, cars, medical devices, IoT applications, and high-performance computing. Companies from automakers to newly emerged cloud service providers and private spaceflight businesses have rushed to establish in-house semiconductor divisions to both gain a better grasp of the industry supply chain, and to accelerate innovation for their differentiated products and services. One effect of this phenomenon is a renaissance in semiconductor startups, where venture capital funding for semiconductor companies has more than doubled from 2021 to 2022[1].
Startups have driven semiconductor innovation from the very beginnings of the tech industry. Innovative products and business models often provide the foundations of a promising startup. Since its founding 35 years ago, TSMC has been working with startups across the industry, providing access to its technologies and manufacturing capacity to help them grow and thrive. We are honored to have prospered together with industry juggernauts, such as NVIDIA, Broadcom, Marvell, and MediaTek, since their early days. As the world’s first dedicated semiconductor foundry, TSMC has been tireless in researching and investing in process technology advancements, manufacturing capacity expansion, and design ecosystem development to enable those companies to unleash their innovation. Their partnership with TSMC allows each of them to invest in chip design and innovation rather than in capital-intensive semiconductor manufacturing and has given them the flexibility to innovate broadly and creatively. Those companies are now the wellspring of innovation that empowers our electronic world.
TSMC vigorously strives to support startup customers to confidently transform their forward-looking idea from inspiration into real products, manufactured at high volume. For example, the TSMC Open Innovation Summit (OIS) (formerly the TSMC Customer Collaboration Summit) brings together startups, investors, and other chip innovators to discuss transformational silicon designs for autonomous driving, HPC, AI, 5G, IoT, Metaverse, and Medical/Bio applications, as well as share valuable findings on how to accelerate the innovation cycle through effective collaboration, drawing synergy from each other and consolidating resources to achieve greater success. Their disruptive innovations are the dynamo that drives the semiconductor industry development in the United States and around the world.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related Blogs
- Reducing design cycle time for semiconductor startups: The path from MVP to commercial viability
- Unleashing Innovation and Energy Efficiency at TSMC Events
- Unleashing Gaming and AI Innovation Across Consumer Device Markets with New Arm GPUs
- GlobalFoundries enabling the next wave of "foundry" innovation
Latest Blogs
- ReRAM in Automotive SoCs: When Every Nanosecond Counts
- AndeSentry – Andes’ Security Platform
- Formally verifying AVX2 rejection sampling for ML-KEM
- Integrating PQC into StrongSwan: ML-KEM integration for IPsec/IKEv2
- Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform