GlobalFoundries enabling the next wave of "foundry" innovation
According to Mojy Chian, Senior Vice President, Design Enablement, GlobalFoundries, continued innovation in the foundry business demands a new approach. He was speaking at the recently held International Electronics Forum (IEF) 2010 organized by Future Horizons in Dresden, Germany.
GlobalFoundries is bringing a highly integrated model to foundry, which involves the extension of customer operations, early customer-foundry engagement, as well as close collaboration and joint technology development. This would enable faster time to volume and market, leading to smooth ramps to mature yields. Chian added that design, manufacturing, and EDA/IP solutions must work in unison to accomplish this.
According to him, the industry desperately needs a new approach. Here, he discussed GlobalFoundries’ 28nm collaborative innovation, which involves four phases.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related Blogs
- STMicroelectronics to give Globalfoundries a go
- Globalfoundries six months on: maybe we could use another foundry
- UMC versus GLOBALFOUNDRIES
- TSMC leads 2009 foundry rankings; GlobalFoundries top challenger!
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?