GlobalFoundries enabling the next wave of "foundry" innovation
According to Mojy Chian, Senior Vice President, Design Enablement, GlobalFoundries, continued innovation in the foundry business demands a new approach. He was speaking at the recently held International Electronics Forum (IEF) 2010 organized by Future Horizons in Dresden, Germany.
GlobalFoundries is bringing a highly integrated model to foundry, which involves the extension of customer operations, early customer-foundry engagement, as well as close collaboration and joint technology development. This would enable faster time to volume and market, leading to smooth ramps to mature yields. Chian added that design, manufacturing, and EDA/IP solutions must work in unison to accomplish this.
According to him, the industry desperately needs a new approach. Here, he discussed GlobalFoundries’ 28nm collaborative innovation, which involves four phases.
To read the full article, click here
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
Related Blogs
- UMC versus GLOBALFOUNDRIES
- TSMC leads 2009 foundry rankings; GlobalFoundries top challenger!
- The GlobalFoundries Enigma
- GlobalFoundries and the Mobile World Congress
Latest Blogs
- Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards
- Pushing the Boundaries of Memory: What’s New with Weebit and AI
- Root of Trust: A Security Essential for Cyber Defense
- Evolution of AMBA AXI Protocol: An Introduction to the Issue L Update
- An Introduction to AMBA CHI Chip-to-Chip (C2C) Protocol