TSMC bags up Apple for 2020
January 6, 2020
TSMC will remain the sole foundry partner of Apple for the chips for its 2020 iPhone series, reports the Chinese-language Commercial Times.
The chips will be made on TSMC’s 5nm EUV process and production starts in Q2 2020.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- TSMC Gets 28nm Yield Up Over 80%
- Did Qualcomm and Apple Attempt to Bribe TSMC?
- TSMC Apple Rumors Debunked!
- TSMC To Tape-Out 20nm Apple Processor This Month
Latest Blogs
- Why What Where DIFI and the new version 1.3
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware