The Risks & Rewards of Early Tapeout
Verification remains a key issue in system-on-chip development. The time taken to verify a high-density SoC design to a high level of confidence can lead teams to think the unthinkable. One of these counterintuitive options is to not exhaustively verify a chip before taping out but use the resulting silicon itself as a cornerstone of the verification process.
A panel session at the recent 51st Design Automation Conference was more or less evenly split on the approach. Early tapeout has its attractions but carries risks and potential costs that go way beyond the price of a mask set for a device that is highly unlikely to make it to production.
To read the full article, click here
Related Semiconductor IP
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- 64 bit RISC-V Multicore Processor with 2048-bit VLEN and AMM
- NPU IP Core for Mobile
Related Blogs
- Arm Compute Platform at the Heart of Malaysia’s Silicon Vision
- Imagination and Renesas Redefine the Role of the GPU in Next-Generation Vehicles
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
Latest Blogs
- Cadence Leads the Way at PCI-SIG DevCon 2025 with Groundbreaking PCIe 7.0 Demos
- Introducing the Akeana 1000 Series Processors
- How fast a GPU do you need for your user interface?
- PCIe 6.x and 112 Gbps Ethernet: Synopsys and TeraSignal Achieve Optical Interconnect Breakthroughs
- Powering the Future of RF: Falcomm and GlobalFoundries at IMS 2025