Who Allegedly Broke Tela's Patents: Is Samsung or Qualcomm the Real Villain?
I recently blogged about the actions filed by Tela Innovations at both the US International Trade Commission (USITC) and in federal district court. Those actions allege that five mobile phone manufacturers -HTC, LG, Motorola Mobility, Pantech, and Nokia - were importing handsets into the US which infringed on seven of Tela’s patents. After posting that blog there were a few follow-up comments and questions on that SemiWiki post which caused me to take a deeper look. This blog is to follow-up on those comments in two areas – “patent trolls” and the bigger story, who really may have broken those patents.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- Samsung going vertical, Qualcomm to cry, CEVA to laugh
- Qualcomm versus Samsung?
- Qualcomm LTE Modem Competitors? Samsung, Intel, Mediatek, Spreadtrum, Leadcore... or simply CEVA!
- Why Qualcomm Lost Samsung and Will Get Them Back!
Latest Blogs
- Why What Where DIFI and the new version 1.3
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware